Hi-Yen Trading International Ltd. was founded in 1995. Since then we have been growing to a global oriented, multi-million dollar company, supplying capital equipment and materials to the semiconductor and e-mobility industry while also providing tailor made solutions for our partners.
We at Hi-Yen firmly believe that the semiconductor and e-mobility industry will continue to grow exponentially and we're ready to provide solutions for regular electronic connections, optoelectronics as well as IGBT and battery modules.
Hi-Yen is committed to total customer satisfaction through providing consistently high quality products and services.
Hi-Yen is the representative of pioneering firms which offer revolutionary and cutting edge equipment for the semiconductor and e-mobility industry, many of which became the market standards.
We believe that the best products are produced with the best equipment.
Ultrasonic Wire Bonders
Laserbonder
Ultrasonic Wire Bonders
Bond Tester
DIE-Bonders
DIE-Bonders
Since its foundation in 1978, F & K DELVOTEC GmbH has regularly done pioneering work in the development of revolutionary new developments that subsequently become market standards.
F&K Delvotec's wire and laser bonders excel at reliablity and flexibility like no other on the market while offering a wide range of solutions which are able to meet every need, from contacting electronic componenets to thick aluminium and copper ribbons on DCB substrates and copper terminals via laser bonding.
F&S Bondtec serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future with their Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.
Tresky GmbH is one of the world’s leading machine manufacturers for placement systems in the high-precision sector offering more than 40 years of experience in the semiconductor industry. All standard packaging technologies can be realized with one flexible TRESKY machine. They have extensive experience with multi-chip module applications. It is one of their many strengths.
For the past 40 years, Tresky has been perfecting the art of creating handling and pick & place systems.
As a solutions provider, they support specific applications with their highly accurate and innovative systems. Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need. This is made possible by their extensive experience and modular setup which allows adapting various basic systems with countless options for new processes.
With almost 2000 devices installed across the world, often with special & customized equipment, they diligently work to fulfill complex process requirements.
