F&K Delvotec

The compact, space-saving wire bonder F & K M17S is a true multi-talent. In no time at all, it can be converted to all common wire bonding methods.

• The one with the widest space utilisation
• Suitable for all wire bonding processes.
• Working area: X = 254 mm (10”) ; Y = 152mm (6”) ; Z = 40mm
• Quick and easy changeover in less than 15 minutes

Your Products

• MEMS, Sensors
• Optoelectronics, RF / HF
• COB, HYBRID
• Power Devices and Systems
• BMS

The only wire bonder on the market that offers the possibility of bonding thin wire and thick wire or thick wire ribbons in one process on one machine.

• The one with two bonding heads for two different wire bonding processes
• Extremely space-saving working ranges: X = 254 mm, Y = 153 mm, (optional 204 mm), Z = 40 mm (optional 60 mm)
• Wire diameter 17 to 600 μm, max. ribbon cross-section 2,000 x 300 μm
• Quick and easy changeover in less than 15 minutes

Your Products

• MEMS, Sensors
• Optoelectronics, RF / HF
• COB, HYBRID
• Power Devices and Systems
• BMS

The fully automatic wire bonder F&K M17L not only offers the world's largest working range for thin wire bonders. It can also be converted to bond heads for deep access or thick wire.

• Variants for extremely high components up to 500 mm clearance height
• Large working range: 635 mm (X) x 350 mm (Y), 100 mm (Z); 25" x 14"
• Wire diameter 17 to 600 μm, max. ribbon cross-section 2,000 x 300 μm
• Quick and easy changeover in less than 15 minutes

Your Products

• MEMS, Sensors
• Optoelectronics, RF / HF
• COB, HYBRID
• Power Devices and Systems
• BMS
• Battery Cells

The fully automatic wire bonder F&K M17L not only offers the world's largest working range for thin wire bonders. It can also be converted to bond heads for deep access or thick wire.

• Wide range of automation options from manual to inline
• Large working range: 635 mm (X) x 350 mm (Y), 100 mm (Z); 25" x 14"
• Access to the working area from all sides for manual feeding
• Robot arm guides bonding head completely vibration-free over the entire working area

Your Products

• Power Devices
• Power Systems
• BMS
• Battery Cells

The combination of wire bonding and laser welding was developed in cooperation with the Fraunhofer ILT Aachen.

• Greater current-carrying capacity due to larger conductor cross-sections than with ultrasonic bonding
• Low production costs due to low demands on the surface quality of the joining partners
• Allows XYZ position tolerances compared to laser welding due to touch down sensor and image recognition
• No mechanical damage to the components due to lower clamping forces of the component holder
• Combines two processes on one machine without conversion: laser bonding of ribbons, laser tab bonding of connectors

Your Products

• PCB, Casting & Automotive
• Power Devices
• Power Systems
• BMS
• Battery Cells

It offers the perfect solution of terminal contacting for power modules as well as for battery assembly applications. Aluminium, copper or nickel ribbons are welded using laser energy with low bonding force. The process offers a wider range of different material joining partners compared to ultrasonic wire bonding and can be easily automated.

• Greater current-carrying capacity due to larger conductor cross-sections than with ultrasonic bonding
• Low production costs due to low demands on the surface quality of the joining partners
• Allows XYZ position tolerances compared to laser welding due to touch down sensor and image recognition
• No mechanical damage to the components due to lower clamping forces of the component holder
• Combines two processes on one machine without conversion: laser bonding of ribbons, laser tab bonding of connectors

Your Products

• PCB, Casting & Automotive
• Power Devices
• Power Systems
• BMS
• Battery Cells