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Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder G5-2 was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry. It is the only wire bonder on the market offering the possibility to bond fine and heavy wire or heavy ribbon in a single machine.
Benefits of the G5-2 bonder :
- Combination of fine and heavy wire in a single process
- Wire diameters from 17 to 600£gm, ribbon dimensions 2.000 x 300£g
- Rapid and easy conversion in under 15 minutes
- Extremely space saving
- Work area in mm: X=254 mm, Y= 153 mm (optionally 204 mm), z = 40mm (optionally 60 mm)
- Continuous monitoring and control of the bond process using the camera aided Bond Process Contol
- Comprehensive automation from manual to in-line
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